电子元件与材料Issue(9)：13-17,24,6.DOI:10.14106/j.cnki.1001-2028.2015.09.003
导电胶在倒装芯片互连结构中的应用进展
Application of conductive adhesive in flip chip interconnection structure
刘培生 1杨龙龙 1刘亚鸿 1卢颖1
作者信息
- 1. 南通大学 江苏省专用集成电路设计重点试验室，江苏 南通 226019
- 折叠
摘要
Abstract
The basic classification of conductive adhesives and the percolation theory are introduced. The application of ACA, ICA and NCA are discussed in flip chip interconnection. The reliability of conductive adhesive interconnection structure is analyzed. At last, the development trend of conductive adhesive is expected.关键词
倒装芯片/集成电路/综述/导电胶/可靠性/封装Key words
flip chip/integrated circuit/review/conductive adhesive/reliability/package分类
信息技术与安全科学引用本文复制引用
刘培生,杨龙龙,刘亚鸿,卢颖..导电胶在倒装芯片互连结构中的应用进展[J].电子元件与材料,2015,(9):13-17,24,6.
