电子元件与材料Issue(9)：54-58,5.DOI:10.14106/j.cnki.1001-2028.2015.09.012
塑封器件芯片与塑封料界面分层的研究
Delamination research of die and EMC interface of plastic packaging device
刘培生 1卢颖 1杨龙龙 1刘亚鸿1
作者信息
- 1. 南通大学 江苏省专用集成电路设计重点实验室，江苏 南通 226019
- 折叠
摘要
Abstract
A specified LQFP package was used as a demonstrator. The three dimensional model was established by finite element software ANSYS. Using the fracture parameter—J integrality, three models of delaminating area on the die/EMC interface were discussed and analyzed. Then, the main delamination extension mode was achieved, which was convex delaminating area. A new delamination extension process was put forward at the same time. The temperature and radius of crack effect on the delamination were discussed based on this convex delamination model. The simulation data show that the delaminating area can be extended easily under the extreme low or high temperatures, and the trend of crack extension is also affected by the radius of crack under the condition of a certain stress.关键词
塑封器件/J积分/分层/裂纹扩展/仿真/新模型Key words
plastic packaging device/J integrality/delamination/crack extension/simulation/new model分类
信息技术与安全科学引用本文复制引用
刘培生,卢颖,杨龙龙,刘亚鸿..塑封器件芯片与塑封料界面分层的研究[J].电子元件与材料,2015,(9):54-58,5.
