电子元件与材料Issue(9)：71-74,4.DOI:10.14106/j.cnki.1001-2028.2015.09.016
MEMS多层结构的热应力分析
Thermal stress analysis on multilayer structure of MEMS
刘加凯1
作者信息
- 1. 武警工程大学 装备工程学院，陕西 西安 710086
- 折叠
摘要
Abstract
The failure modes such as warp and delamination in MEMS multilayer structure will happen under thermal load, and the interfacial stress caused by thermal load is the immediate cause to the failure modes. By using bimetal strip stress model advanced by Suhir.E, interfacial shearing stress and peeling stress caused by thermal load were analyzed. The analysis shows that shearing stress and peeling stress present exponential increatse along with the distance from centre of bonded pair, and increase sharply in the end until achieve maximum. Interfacial stress is influenced linearly by difference of two material thermal expansivity and temperature loaded, and also influenced by the thickness of two material layers. Bi-layer structure composed by Cu/Cr was analyzed with Matlab on the relationship between interfacial stress and material thickness. The result shows that the interfacial stress is influenced by the thickness ratio of two material layers. When the thickness ratio of Cu to Cr layer is 1.5, the shearing stress and peeling stress is both small, which can reduce the probability of delamination failure mode.关键词
MEMS/多层结构/界面应力/剪切应力/剥离应力/温度载荷/分层失效Key words
MEMS/multilayer structure/interfacial stress/shear stress/peeling stress/thermal load/delamination failure分类
信息技术与安全科学引用本文复制引用
刘加凯..MEMS多层结构的热应力分析[J].电子元件与材料,2015,(9):71-74,4.
