电子元件与材料Issue(9)：101-104,4.DOI:10.14106/j.cnki.1001-2028.2015.09.023
基于热疲劳状态监测的PCB无铅焊点可靠性研究
Reliability of PCB lead-free solder joints based on monitoring thermal fatigue state
摘要
Abstract
Shear force-thermal fatigue state conferring test studies on lead-free solder joints of PCB chip resistor and lead solder joints were conducted. The shear force experiment data in limited temperature cycles was obtained by using comparing method based on pseudo failure life. Shear force test data curves were fitted by using nonlinear least square method. The results indicate that the size of package is an important factor to thermal fatigue property of solder joints, lead-free solder joints’ thermal fatigue performance is better than that of lead solder joints in limited 1 500 cycles.关键词
片式元件/无铅焊点/热疲劳状态/剪切力/非线性最小二乘法/可靠性Key words
chip component/lead-free soldering joint/thermal fatigue state/shearing force/nonlinear least square method/reliability分类
信息技术与安全科学引用本文复制引用
毛书勤,郭立红,许艳军,曹彦波,郭汝海..基于热疲劳状态监测的PCB无铅焊点可靠性研究[J].电子元件与材料,2015,(9):101-104,4.基金项目
吉林省科技发展计划项目资助 （）
