摘要
Abstract
Formulas of epoxy resin molding compound for electronic packaging is investigated in this article. Epoxy resin is substrate, dimethy-imidazole is agent, fillers are crystal silicon powder, fused silicon powder, global silicon powder, by changing of activator agent, cross-linker, curing agent, filler’s type and fraction, by the way of adding nanometer silicon powder modifier. We compare their microstructure, coefficient of thermal expansion etc by SEM with different formulas. Then formulas is developed to get better properties of epoxy resin packaging matrix, better coefficient of thermal expansion, low stress, to match the requirements of large number of IC and electronic packaging performance.关键词
环氧模塑料/表征/线膨胀系数Key words
epoxy molding/characterization/coefficient of thermal expansion分类
信息技术与安全科学
