电子与封装Issue(6)：1-6,37,7.
BGA植球工艺技术
The Soldering-Ball Process Technology of BGA
李丙旺 1吴慧 1向圆 1谢斌1
作者信息
- 1. 北方通用电子集团微电子部，安徽蚌埠233042
- 折叠
摘要
Abstract
The BGA technology is an advanced performance packaging process,and is used to package device which has a lot of pins.The projecting feature of BGA is to use soldered ball as pins,this not only advanced packaging density, also advanced performance.The soldered ball process which is the key to BGA will effect the performance and reliability of the device.The main factors of effecting BGA’s soldered ball process have:the material of soldered ball, the process of soldered ball and solder-reflow.This paper expounds the detail process of soldering ball and solder-reflow,peovides the test method,discusses the reliability of the process of soldering ball based on introducing baseplate, solder paste, soldered ball etc of the BGA technology.关键词
BGA/植球/回流焊Key words
BGA/soldering ball/solder-reflow分类
信息技术与安全科学引用本文复制引用
李丙旺,吴慧,向圆,谢斌..BGA植球工艺技术[J].电子与封装,2013,(6):1-6,37,7.
