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印制电路板电磁兼容设计浅析

彭亮 黄峥嵘 黄明晖 杜迎

电子与封装Issue(6):24-28,5.
电子与封装Issue(6):24-28,5.

印制电路板电磁兼容设计浅析

The Research of EMC’s Design for PCB

彭亮 1黄峥嵘 1黄明晖 1杜迎1

作者信息

  • 1. 中国电子科技集团公司第58研究所,江苏无锡214035
  • 折叠

摘要

Abstract

The main reason that caused electromagnetic interaction (EMI) on PCB (Printed-Circuit-Board) was introduced in this paper. The principle of EMI was studied and some ways to decrease EMI were found. The PCB’s quality and reliability were ensured basically and the affect of EMI to PCB was decreased by analyzing PCB’s resistance, routing and design of single layer and double layer. Some ways, such as ground net, the construction of I/O ground, ground rule and etc, were studied so that the more methods to decrease EMI farther were gained.

关键词

电磁干扰/印制电路板/地线/布线

Key words

electromagnetic interaction (EMI)/PCB/ground/routing

分类

信息技术与安全科学

引用本文复制引用

彭亮,黄峥嵘,黄明晖,杜迎..印制电路板电磁兼容设计浅析[J].电子与封装,2013,(6):24-28,5.

电子与封装

1681-1070

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