电子与封装Issue(7)：32-34,42,4.
硅片在背面减薄工序中降低破片率的研究
Study of the Scrap Rate Decreace During Silicon Wafer Grinding
摘要
Abstract
With the development of semiconductor industry, chip thickness requirements thiner and thinner. Chip is been thin by wafer grinding in semiconductor manufacturing. However, due to the silicon wafer thinning, the wafer scrap rate also increased during production. It comes high cost with scrap because chip has almost finished. This thesis studies the root cause of silicon wafer scrap during wafer grinding and production circulation. By improving some parts of the equipment and changing some methods in production circulation in, data shows that the scrap rate decreace maybe come true during silicon wafer grinding.关键词
硅片/背面减薄/破片率Key words
silicon wafer/back grinding/the scrap rate分类
信息技术与安全科学引用本文复制引用
池慧雄..硅片在背面减薄工序中降低破片率的研究[J].电子与封装,2013,(7):32-34,42,4.
