电子元件与材料Issue(10)：88-90,94,4.DOI:10.14106/j.cnki.1001-2028.2015.10.022
基于纳米压痕法的SnBi-xNi钎料的塑性比较
Comparison of plastic characterization of SnBi-xNi solders by nanoindentation
摘要
Abstract
By using nanoindentation method, the ratio of plastic strain to total strain was used to characterize the solder plasticity. The hardness, modulus of elasticity and plasticity of SnBi-xNi (x=0, 0.05, 0.1, 0.15 and 0.2) solder alloy were compared. The results show that the hardness and elastic modulus of Sn58Bi solder alloy increase after adding Ni. The solder hardness and elastic modulus reach the maximum values when 0.1% ofw(Ni) is added. Whenw(Ni) is more than 0.1%, the hardness and elastic modulus of SnBi-xNi solder alloy decline. With 0.05%–0.1% ofw(Ni) adding in SnBi solder alloy, the organization of solder alloys is refined, and the solder alloys plasticity is improved. Whenw(Ni) is higher than 0.15%, the solder alloy plasticity is reduced.关键词
SnBi-xNi/钎料/塑性/硬度/弹性模量/纳米压痕Key words
SnBi-xNi/solder/plasticity/hardness/elastic modulus/nanoindentation分类
矿业与冶金引用本文复制引用
杨淼森,孔祥霞..基于纳米压痕法的SnBi-xNi钎料的塑性比较[J].电子元件与材料,2015,(10):88-90,94,4.基金项目
哈尔滨科技创新人才研究专项资金资助 （）
