电子元件与材料Issue(1)：7-11,5.DOI:10.14106/j.cnki.1001-2028.2016.01.002
功率电子封装用陶瓷基板技术与应用进展
Progress of technologies and applications of ceramic substrate for the packaging of power electronics
摘要
Abstract
Technologies and development tendency of ceramic substrates for the packaging of power electronic devices are reviewed, especially focused on the preparation and characteristics of thick film ceramic (TFC), directed bonded copper (DBC) and directed plated copper (DPC). Finally, the applications of ceramic substrate in the fields of IGBT, LD, LED packaging are analyzed.关键词
陶瓷基板/散热/综述/功率电子/电子封装/LED封装Key words
ceramic substrate/thermal management/review/power electronics/electronic packaging/LED packaging分类
信息技术与安全科学引用本文复制引用
程浩,陈明祥,郝自亮,刘松坡..功率电子封装用陶瓷基板技术与应用进展[J].电子元件与材料,2016,(1):7-11,5.基金项目
湖北省科技支撑计划项目资助（No.2015BAA104）；材料复合新技术国家重点实验室（武汉理工大学）开放基金项目资助（No.2014-KF-11）；华中科技大学自主创新研究基金项目资助 （）
