电子与封装Issue(1)：5-8,37,5.
引线框架塑料封装集成电路分层及改善
Delamination and Its Countermeasures in IC Plastic Package
周朝峰 1周金成 1李习周1
作者信息
- 1. 天水华天科技股份有限公司，甘肃天水 741000
- 折叠
摘要
Abstract
Delamination is one of the common quality and reliability issues during the assembly processes and/or after reliability test in the field of IC plastic packages. How to resolve it is one of the popular researches by material suppliers, assembly process engineers and reliability engineers. The root causes of delamination and its impacts to IC plastic package are elaborated in this paper. A series of effective countermeasures against delamination are raised in this paper also, through deeply analyzing the product structure, materials and processes, which are using in IC plastic packages. One of the research results is to provide theoretical support to improve the reliability of IC plastic packages.关键词
塑料封装/集成电路/分层Key words
plastic package/IC/delamination分类
信息技术与安全科学引用本文复制引用
周朝峰,周金成,李习周..引线框架塑料封装集成电路分层及改善[J].电子与封装,2016,(1):5-8,37,5.
