电子元件与材料2016，Vol.35Issue(4)：80-83,4.DOI:10.14106/j.cnki.1001-2028.2016.04.019
基于细观损伤模型的SnAgCu材料特性研究
Material characteristics study of SnAgCu based on microscopic damage model
摘要
Abstract
Based on micromechanical damage constitutive model idea, considering the effect of micro voids evolution, the Sn3.0Ag0.5Cu material characteristics in microelectronics packaging and working joint failure mechanism were researched. Based on the experimental data, combined with the fitting method, Gurson-Tvergaard-Needleman (GTN) constitutive model parameters were determined, the stress and strain response data under constant strain load were compared with the experimental data, and the validity of the model was verified.关键词
Sn3.0Ag0.5Cu/GTN/微孔洞失效/细观损伤/焊点/拉伸试验Key words
Sn3.0Ag0.5Cu/GTN/micro void failure/micromechanics damage/solder joint/tensile test分类
力学引用本文复制引用
胡楠,梁利华,张元祥,张继成,许杨剑..基于细观损伤模型的SnAgCu材料特性研究[J].电子元件与材料,2016,35(4):80-83,4.基金项目
国家自然科学基金资助项目（No.51375447；51375448）；浙江省自然科学基金资助项目 （）
