电子元件与材料2016，Vol.35Issue(4)：84-88,5.DOI:10.14106/j.cnki.1001-2028.2016.04.020
磁场对Sn-0.3Ag-0.7Cu焊点显微组织及性能影响研究
Effect of magnetic field on microstructure and behaviors of Sn-0.3Ag-0.7Cu solder joint
摘要
Abstract
Low silver lead-free solder joints, Sn-0.3Ag-0.7Cu (SAC0307), was employed in this investigation. By applying a uniform magnetic field of 2.3T during the solder solidification process, the effects of magnetic field on the solidification process and solid-state diffusion behavior were investigated. By comparing the behaviors of Fe or Ni reinforced SAC0307, the characterizations of SAC0307 alloy after solidification and solid-state diffusion in different environments were recognized. The microstructure evolution of low silver lead-free solder under the coupling effect of magnetic field and 3×103 A/cm3 current density stressing was studied. The results indicate that the morphology of intermetallic compound (IMC) layer which locates at the joint interface transforms from scallop type into needle-like type during solidification process under static magnetic field. Besides, IMC tends to grow rapidly into the matrix. The employments of Fe and Ni elements promote IMC growth at the joint interface.关键词
低银无铅钎料/静磁场/凝固/焊膏/显微组织/金属间化合物Key words
low silver lead-free solder/static magnetic field/solidification/soldering paste/microstructure/IMC分类
信息技术与安全科学引用本文复制引用
马立民,田雨,左勇,郭福..磁场对Sn-0.3Ag-0.7Cu焊点显微组织及性能影响研究[J].电子元件与材料,2016,35(4):84-88,5.基金项目
国家自然科学基金资助项目（No.51301007）；北京市自然科学基金资助项目（No.2144044）；教育部博士点学科专项科研基金资助项目 （）
