电子元件与材料2016，Vol.35Issue(4)：89-93,5.DOI:10.14106/j.cnki.1001-2028.2016.04.021
模塑封器件模塑化合物与铜的界面裂纹扩展
Crack propagation of interface between molding compound and copper of molding plastic packaging devices
摘要
Abstract
Aimed at the quasi-static crack propagation of prescribed path of epoxy molding compound (EMC) and copper interface, ANSYS was used to establish the model and simulate interface crack propagation under single and cyclic displacement loading condition. J-integral of interface crack propagation was the analysis target. The effect of cyclic displacement loading on the interface crack propagation was analyzed under two cases of the linear-elastic and elastic-plastic copper material properties. The result shows that the crack tip opening angle (CTOA) is zero during the unloading process of cyclic loading under the linear-elastic condition and the gap of interface is closed. CTOA is not zero and the gap of interface is not closed when the material property is elastic-plastic. The interface gap of two materials increases and the value of J-integral decreases with the decrease of yield stress.关键词
线弹性/弹塑性/模塑封器件/裂纹尖端张开角/裂纹扩展/J积分Key words
linear-elastic/elastic-plastic/molding plastic package device/crack tip opening angle/crack propagation/J-integral分类
信息技术与安全科学引用本文复制引用
张维海,蔡苗,杨道国..模塑封器件模塑化合物与铜的界面裂纹扩展[J].电子元件与材料,2016,35(4):89-93,5.基金项目
国家自然科学基金资助项目（No.51366003）；广西研究生教育创新计划资助项目 （）
