电子元件与材料2017，Vol.36Issue(1)：80-84,5.DOI:10.14106/j.cnki.1001-2028.2017.01.016
铝基覆铜板导热系数测试方法改进分析
Improvedanalysis on test approach of aluminum basedcopper clad laminate thermal conductivity
任成伟 1师剑军 1马卫东 1张勇1
作者信息
- 1. 空军工程大学 防空反导学院，陕西 西安 710051
- 折叠
摘要
Abstract
To measureeasilyand accurately the heat conduction parameter of aluminum base copper clad laminate, an improved heat conduction parametermeasurementapproach was designed.This approach took a sample as a reference, the heat conduction parameter of a PCB was calculated based on the theory that the heat conduction parameter proportion between two PCBs were nearly same. A novel aluminum base copper clad laminate test platformwas constructed through theoryanalysisand simulation validation. The experiment results reveal thatthisplatform can reduce measurement error effectively, simplify the operation process,andsave the cost of experiments.关键词
铝基覆铜板/导热系数/测试方法/热阻/热板/散热Key words
aluminum based copper clad laminate/thermal conductivity/test method/hot resistance/hot plate/hot dissipation分类
信息技术与安全科学引用本文复制引用
任成伟,师剑军,马卫东,张勇..铝基覆铜板导热系数测试方法改进分析[J].电子元件与材料,2017,36(1):80-84,5.
