电子元件与材料2017，Vol.36Issue(2)：69-76,8.DOI:10.14106/j.cnki.1001-2028.2017.02.015
电子封装中Cu/Cu3Sn/Cu焊点的制备工艺及组织演变
Fabricating processand microstructure evolutionof Cu/Cu3Sn/Cu solder joints in electronic packaging
摘要
Abstract
Electroplatingwas used todeposit a 4 μm thick Snlayeron the Cusubstrate.Cu/Sn+Sn/Cusandwich structure was soldered under different parametersin order to fabricate Cu/Cu3Sn/Cu solder joints. Itis found that the joints soldered at 300℃with 1N pressure and 3h argon protectionare completely composed of Cu/Cu3Sn/Cu. Then the growth morphologies of IMCs and the mechanism of different interfaces formation were analyzed. The results show that there is scallop-like Cu6Sn5formed at the Cu-Sn interface afterbeing solderedfor10mins and a thinCu3Snlayerisformed between Cu and Cu6Sn5. The interfaces of Cu/Cu3Sn andCu3Sn/Cu6Sn5are flat. Cu6Sn5at the two original boundary planes connect with each other with the increasesof solderingtime. When the liquid Sn is totally consumed, there is no new Cu6Sn5formed. Meantime,Cu3Sn increase quickly at the expense of consumed Cu6Sn5until Cu6Sn5are totally transformed into Cu3Sn.关键词
全Cu3Sn焊点/钎焊/金属间化合物/扇贝状/界面反应/组织演变Key words
fullCu3Snsolder joint/soldering/intermetallic compounds (IMCs)/scallop-like/interfacial reaction/microstructure evolution分类
信息技术与安全科学引用本文复制引用
梁晓波,李晓延,姚鹏,余波,牛兰强..电子封装中Cu/Cu3Sn/Cu焊点的制备工艺及组织演变[J].电子元件与材料,2017,36(2):69-76,8.基金项目
国家自然科学基金资助（No.51575011）；国家自然科学基金资助（No.51275007）；北京市自然科学基金资助 （）
