电子元件与材料2017，Vol.36Issue(3)：7-10,4.DOI:10.14106/j.cnki.1001-2028.2017.03.002
类球形金粉粒径对Au-金属化低温共烧陶瓷微观结构及翘曲度的影响
Effect of particle size of near-sphere gold powder on microstructure and cambering of Au-metallized low temperature cofired ceramics
摘要
Abstract
The shrinkage behavior of low temperature co-fired ceramics (LTCC) during cofiring process and the main factors having an effect on cambering of metallized LTCC ceramics after cofiring were investigated. Six kinds of near-sphere gold powders with different average diameters, ranging from 0.7 μm to 2.3 μm, were chosen to formulate gold conductivepastes together with a proper organic vehicle and glass frit. The pastes were printed on LTCC green tapes, laminated and cofired according to conventional LTCC process. The microstructure and cambering of each ceramic,sheet resistance of each pastewere measured and calculated respectively. Experimental results show that pastes formed with large particle size gold powder have advantages in bringing down the cambering extent of the ceramic, but the film shows poor sintering and densification as well as high sheet resistance.关键词
金属材料/低温共烧陶瓷/近球形金粉/翘曲/粉体粒径/致密度Key words
metal materials/LTCC/near-sphere gold/cambering/particle size of powder/densification分类
信息技术与安全科学引用本文复制引用
罗慧,李世鸿,梁云,李文琳,刘继松,李俊鹏..类球形金粉粒径对Au-金属化低温共烧陶瓷微观结构及翘曲度的影响[J].电子元件与材料,2017,36(3):7-10,4.基金项目
The Fund of the State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals (No.SKL-SPM-201532) （No.SKL-SPM-201532）
Key Technologies of Preparing LTCC Electronic Pastes and Their Industrial Applications(No.2015020211) （No.2015020211）
Development&Industrialization of Precious Metal Pastes Used in Integrated Chip Components(No.2016020201) （No.2016020201）
