电子元件与材料2017，Vol.36Issue(5)：37-43,7.DOI:10.14106/j.cnki.1001-2028.2017.05.008
3D封装中电镀参数对微凸点制备的影响
Effects of plating parameters on fabrication of micro-bump in 3-D integration
摘要
Abstract
Electronic information technology proposed high density, high quality, small size and low cost requirements on packaging joints. Therefore, 3-D packaging technology appeared. The fabrication of micro-bump is very important for 3-D packaging. In this study, electroplating was used to deposited micro-level Sn layer on the Cu substrate and the surface condition of Sn layer in different parameters were observed by SEM and AFM to analyze the influence law of plating parameters on the surface of Sn layer. In addition, the relationship between electroplating time and plating thickness was obtained. The results show optimal parameters for fabricating high quality Sn layer are: H2SO4 of 160 g/L, environment temperature of 25 ℃, current density of 1 A/dm2. The thickness of plating layer is proportional to the plating time.关键词
3D封装/微凸点/酸性电镀/电镀参数/表面状态/镀层厚度Key words
3D-package/micro-bump/acidic electroplating/parameters/surface condition/thickness of plating layer分类
信息技术与安全科学引用本文复制引用
梁晓波,李晓延,姚鹏,李扬,金凤阳..3D封装中电镀参数对微凸点制备的影响[J].电子元件与材料,2017,36(5):37-43,7.基金项目
国家自然科学基金面上项目资助(No.51575011) （No.51575011）
北京市自然科学基金资助(No.2162002) （No.2162002）
