电子元件与材料2017，Vol.36Issue(5)：44-48,54,6.DOI:10.14106/j.cnki.1001-2028.2017.05.009
面向引线框架封装的热阻建模与分析
Modeling and analysis of thermal resistance for lead frame package
摘要
Abstract
Aim at the general QFP48 lead frame package, the heat transfer mechanism was firstly discussed, and the theoretical computing results for the thermal resistance was provided; then, the QFP48 finite element model was established by utilizing the Ansys Icepak software. The simulated results show good consistency with the theoretical analysis on the heat transfer mechanism. Finally, methods to reduce the thermal resistance and to improve the thermal reliability were discussed. The simulation results show, by properly increasing the thermal conductivity of the molding compound, increasing the area of PCB and introducing a forced convection, that the thermal resistance of QFP48 package is reduced and the heat dissipation effect is improved.关键词
引线框架封装/热阻/建模/热仿真/优化分析/IcepakKey words
lead frame package/thermal resistance/modeling/thermal simulation/optimization analysis/Icepak分类
信息技术与安全科学引用本文复制引用
孙海燕,缪小勇,赵继聪,孙玲,王洪辉..面向引线框架封装的热阻建模与分析[J].电子元件与材料,2017,36(5):44-48,54,6.基金项目
江苏省科技厅重点研发计划项目资助(No.BE2016007-2) （No.BE2016007-2）
江苏省高校自然科学研究重大项目资助(No.16KJA510006) （No.16KJA510006）
南通市科技应用基础研究计划项目资助(No.GY12015004) （No.GY12015004）
