电子元件与材料2017，Vol.36Issue(7)：17-22,6.DOI:10.14106/j.cnki.1001-2028.2017.07.003
Cu/Sn/Cu界面元素的扩散行为研究现状
Research status of element diffusion behavior in Cu/Sn/Cu interfaces
摘要
Abstract
The research trend and development of interfacial diffusion at home and abroad are summarized,including inteffacial effect of aging process and Cu/Sn/Cu interfacial diffusion behavior.Then,interfacial reaction between Sn based solder and Cu substrate in aging process and the influencing factors of Kirkendall void formation are introduced emphatically.Besides,Kirkendall void formation is directly related to the diffusion of interfacial component elements.Lastly,the questions existed in the diffusion behavior of Cu/Sn/Cu solder joints are pointed out,and the method of combining experiment and molecular dynamics simulation is proposed,which aims at providing further studies with inspirations.关键词
Cu/Sn/Cu/扩散行为/综述/界面反应/柯肯达尔孔洞/焊点Key words
Cu/Sn/Cu/diffusion behavior/review/interface reaction/Kirkendall voids/solder joint分类
信息技术与安全科学引用本文复制引用
李扬,李晓延,姚鹏,梁晓波..Cu/Sn/Cu界面元素的扩散行为研究现状[J].电子元件与材料,2017,36(7):17-22,6.基金项目
国家自然科学基金面上项目资助(No.51275007) （No.51275007）
国家自然科学基金面上项目资助(No.51575011) （No.51575011）
北京市自然科学基金资助(No.2162002) （No.2162002）
