电子元件与材料2017，Vol.36Issue(7)：85-88,92,5.DOI:10.14106/j.cnki.1001-2028.2017.07.017
热载荷下金属间化合物厚度对焊点可靠性的影响
Effect of intermetallic compound thickness on solder joint reliability under thermal cycling loading
摘要
Abstract
Under thermal cycling load conditions,the effect of intermetallic compound(IMC) layers with different thicknesses on the reliability of solder joints was studied.The viscoplastic mechanic behavior of lead-free solder joints with the thermal loading condition was described by using Anand constitutive model.Finite element method was used to simulate the stress-strain variation rule for electronic package devices under thermal cycling condition and to identify the location of key solder joints,and the stress-strain-time curve for the key solder joints was obtained.Then the function relationship between IMC layer thickness and solder joint lifetime was found out by analyzing the relationship curve between IMC layer thickness and solder joint lifetime.The results show that under the thermal loading condition,the thicker the IMC layer is,the less reliability and lifetime of the solder joint.When the thickness of IMC layer reaches 8.5 μm,the influence rate of IMC layer thickness on solder joint lifetime appears obvious change.The influence rate increases abruptly from-32.8 to-404.When the thickness of IMC layer reaches 14.5 μrn,the lifetime data of the solder joint appears to jump.关键词
金属间化合物/等效塑性应变/IMC厚度/热循环载荷/有限元/可靠性Key words
intermetallic compound/equivalent plastic strain/thickness of IMC/thermal cycling loading/FEM/reliability分类
数理科学引用本文复制引用
宋昱含,杨雪霞,崔小朝..热载荷下金属间化合物厚度对焊点可靠性的影响[J].电子元件与材料,2017,36(7):85-88,92,5.基金项目
国家自然科学基金项目资助(No.5157040251 （）
No.11602157) （）
山西省青年科技研究项目资助(No.2015021017) （No.2015021017）
山西省高等学校科技创新项目资助(No.2015167) （No.2015167）
太原科技大学博士启动项目资助(No.20132015) （No.20132015）
