电子元件与材料2017，Vol.36Issue(8)：9-18,10.DOI:10.14106/j.cnki.1001-2028.2017.08.002
片式无源温度补偿衰减器——原理、设计、制作、应用及发展趋势
Passive temperature compensation chip attenuator:principle, design, fabrication, application and future trend
廖进福 1凌志远 2沓世我 2付振晓1
作者信息
- 1. 广东风华高新科技股份有限公司新型电子元器件关键材料与工艺国家重点实验室,广东肇庆526020
- 2. 华南理工大学电子材料科学与工程系,广东广州 510640
- 折叠
摘要
Abstract
Passive temperature compensation attenuators are mainly utilized for the thermal stabilization of RF/microwave amplifier gain.In this paper,the principle,design,fabrication,application and future trend of this type of device are introduced.In comparison with other compensation methods,using this type of component is simple,cost-efficient and of excellent performance.The core design of temperature compensation attenuator is to determine the resistances and temperature characteristics of the NTC and PTC thermistors,so that the attenuation varies almost linearly with temperature while the characteristic impedance maintains essentially constant.Up to present,this type of component has been mainly fabricated by thick film process with serialized thermistor pastes as the key materials.The adoption of thin film process will be the important direction for future development,but the fabrication of the thin film NTC thermistor is still confronted with some demanding challenges,mainly in obtaining proper electrical performance of the material and its serialization.关键词
温度补偿/衰减量/温度系数/热敏电阻/厚膜工艺/薄膜化Key words
temperature compensation/attenuation/temperature coefficient/thermistor/thick film process/thin film process分类
信息技术与安全科学引用本文复制引用
廖进福,凌志远,沓世我,付振晓..片式无源温度补偿衰减器——原理、设计、制作、应用及发展趋势[J].电子元件与材料,2017,36(8):9-18,10.
