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微量Ti对Sn-9Zn-xTi无铅焊料耐蚀性的影响

谢景洋 王正宏 陈一鸣 张弓

电子元件与材料2017,Vol.36Issue(8):103-110,8.
电子元件与材料2017,Vol.36Issue(8):103-110,8.DOI:10.14106/j.cnki.1001-2028.2017.08.019

微量Ti对Sn-9Zn-xTi无铅焊料耐蚀性的影响

Effect of trace Ti on corrosion resistance of lead-free Sn-9Zn-xTi solder

谢景洋 1王正宏 1陈一鸣 1张弓1

作者信息

  • 1. 清华大学机械工程系,北京100084
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摘要

Abstract

The poor corrosion resistance of Sn-Zn lead-free solder are important factors hindering its application.In this paper,by adding trace amounts of Ti to Sn-9Zn eutectic alloys (mass fractions=0,0.01%,0.03%,0.05%,0.1%),the potential dynamic polarization curves (I/E) and electrochemical impedance spectroscopy (EIS) of Sn-9Zn-xTi alloys in 3.5% (mass fraction) NaCl solution were measured.The surface appearance of the alloy was observed by scanning electron microscopy (SEM).The corrosion resistance of the alloy under different immersion time was studied.It is found that trace Ti element can improve the corrosion resistance of Sn-9Zn,and 0.05% Ti (mass fraction) content is the most suitable.

关键词

Sn-Zn无铅焊料/耐蚀性/微量Ti/动电位极化曲线/电化学阻抗谱/腐蚀形貌

Key words

Sn-Zn lead-free solder/corrosion resistance/trace amounts of Ti/potential dynamic polarization curve/electrochemical impedance spectroscopy/corrosion morphology

分类

信息技术与安全科学

引用本文复制引用

谢景洋,王正宏,陈一鸣,张弓..微量Ti对Sn-9Zn-xTi无铅焊料耐蚀性的影响[J].电子元件与材料,2017,36(8):103-110,8.

电子元件与材料

OA北大核心CSCDCSTPCD

1001-2028

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