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脱胚玉米与加酶和不加酶挤压脱胚玉米淀粉颗粒结构和热特性研究

于双双 张东亮 陈善峰 李宏军 马成业

食品工业科技2017,Vol.38Issue(11):71-75,5.
食品工业科技2017,Vol.38Issue(11):71-75,5.DOI:10.13386/j.issn1002-0306.2017.11.005

脱胚玉米与加酶和不加酶挤压脱胚玉米淀粉颗粒结构和热特性研究

Research on granule structures and thermal properties of degerminated corn and extruded degerminated corn with enzyme and without enzyme

于双双 1张东亮 1陈善峰 1李宏军 1马成业1

作者信息

  • 1. 山东理工大学农业工程与食品科学学院,山东淄博255049
  • 折叠

摘要

Abstract

The granule structures and thermal properties of degerminated corn,extruded degerminated corn and enzymatically extruded degerminated corn were evaluated by methods of scanning election microscopy,X-ray irradiation,differential scanning calorimetry.The surface of degerminated corn without extrusion was smooth and complete,the surface of extruded degerminated corn and enzymatically extruded degerminated corn was broken.The crystalinity of degerminated corn,extruded degerminated corn and enzymatically extruded degerminated corn were 5.84,5.63 and 7.40.The beginning of pasting temperature of three materials were 46.97,43.11,48.18 ℃,the peaking of pasting temperature of three materials were 98.63,93.61,98.25 ℃,respectively,the end pasting temperature of three materials were 196.79,185.20,188.54 ℃.The enthalpy change of three materials were 325.40,271.30,284.80 J/g,respectively.The pasting of three materials were 0.16,0.87,0.61.The results showed that extrusion can destroy integrity and crystal structure of degerminated corn,the crystalinity and enthaply change was decreased,the pasting was increased after extrusion.The enthaphy change of enzymatically extruded degerminated corn was higher than extruded degerminated corn,while the pasting was lower.

关键词

挤压/脱胚玉米/颗粒结构/热性能

Key words

extrusion/degermed corn/granule structure/thermal properties

分类

轻工纺织

引用本文复制引用

于双双,张东亮,陈善峰,李宏军,马成业..脱胚玉米与加酶和不加酶挤压脱胚玉米淀粉颗粒结构和热特性研究[J].食品工业科技,2017,38(11):71-75,5.

基金项目

国家自然科学基金(31471676) (31471676)

山东省高等学校优势学科人才团队培育计划 ()

山东理工大学青年教师发展支持计划(4072-112010) (4072-112010)

山东理工大学大学生创新计划(2016032). (2016032)

食品工业科技

OA北大核心CSCDCSTPCD

1002-0306

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