电子元件与材料2017，Vol.36Issue(10)：37-40,45,5.DOI:10.14106/j.cnki.1001-2028.2017.10.006
玻璃粉对片式电阻面电极耐焊性的影响
Influence of different frits on solder-resistance of chip resistor surface electrode
摘要
Abstract
The effects of two kinds of frits, Ca-Si-Al-B and Bi-Si-Al-B on resistivity of chip resistor surface electrode (C1) were studied before and after dealing with soldering. The results show that C1 products have good electrical property and excellent solder-resistance property when mass fraction of Ca-Si-Al-B glass powder is 4%-6%. The analyses of the SEM and EDS declare that the silver layer of the C1 is well-stacked and continuous, which contains Ca-Si-Al-B glass powder after solder-resistance. This is mainly due to the silver being cordoned off by the calcium feldspar needle structure during the Ca-Si-Al-B glass powder sintering and the larger surface tension of the solder.关键词
银浆/片式电阻/面电极/耐焊性/玻璃粉/无铅钎料Key words
silver paste/chip resistor/surface electrode/solder-resistance/frit/lead-free solder分类
化学化工引用本文复制引用
赵科良,梅元,徐小艳,党莉萍,陆冬梅..玻璃粉对片式电阻面电极耐焊性的影响[J].电子元件与材料,2017,36(10):37-40,45,5.基金项目
陕西省高新技术产业发展专项项目资助(No. GX12003) （No. GX12003）
