电子元件与材料2017，Vol.36Issue(10)：46-52,7.DOI:10.14106/j.cnki.1001-2028.2017.10.008
多物理场耦合研究电感线圈电镀铜
Copper electroplating for inductance coil with multi-physics coupling
摘要
Abstract
A model for copper electroplating on inductance coil was established based on multi-physics coupling technology. The characteristics of Cu2+ concentration distribution, current density of coil surface and thickness of copper electrodeposition were obtained by finite element analysis. The effects of pictographic anode and distance between anode and cathode on coating thickness distribution were discussed. The numerical simulation results show that it is helpful to improve the uniformity of copper electrodeposition on coil surface by adding pictographic anode and insulating baffle. When the distance between cathode and anode is small, the range of plating thickness is 0.21μm, the value of COV (Coefficient of Variance) is 0.5% under the condition of electroplating copper with pictographic anode. With the increase of the distance between the anode and cathode, coating thickness increased to 9.5%, and an insulating baffle was needed to improve the uniformity of coating. Then, the range of plating thickness is0.14 μm, the value of COVis 0.4%.关键词
印制电路/电感线圈/电镀铜/多物理场耦合/象形阳极/有限元分析Key words
printed circuit/inductance coil/copper electroplating/multi-physics coupling/pictographic anode/FEM分类
数理科学引用本文复制引用
苏世栋,冀林仙..多物理场耦合研究电感线圈电镀铜[J].电子元件与材料,2017,36(10):46-52,7.基金项目
运城学院院级项目资助 (No. CY-2016005) （No. CY-2016005）
