电子元件与材料2017，Vol.36Issue(12)：36-41,6.DOI:10.14106/j.cnki.1001-2028.2017.12.008
Au20Sn/Au微焊点抗时效性能的研究
Anti-aging performance of Au20Sn/Au micro solder joints
摘要
Abstract
The relationship between soldering parameters and the consumption rate of Au layer as well as the intermetallic compound (IMC) growth rate of Au20Sn/Au micro solder joints was investigated by accelerated aging method. The results indicate that the change speeds of the consumption rate of Au layer and the growthrate of IMC layer increase with the increment of high temperature liquid holding time from 30s to 90s at the same soldering temperature after 150℃aging temperature. When the liquid holding time at 320℃increases to 90s, the change speeds of the consumption rate of Au layer and the growth rate of IMC layer reduce by 24.50% and 56.09%, respectively, when compared to the samples holding at 300℃. The (Ni, Au)3Sn2IMC layer is formed at Au20Sn/Au/Ni layer interface with the increase of aging time, but there is no change in the type of interface between the chip side and the Cu side.关键词
Au20Sn/Au/钎焊工艺/消耗速率/生长速率/界面化合物Key words
Au20Sn/Au/soldering process/consumption rate/growth rate/intermetallic compounds分类
矿业与冶金引用本文复制引用
付明洋,孙凤莲,刘洋..Au20Sn/Au微焊点抗时效性能的研究[J].电子元件与材料,2017,36(12):36-41,6.基金项目
国家高技术研究发展计划资助项目(No. 2015AA033304) （No. 2015AA033304）
