电子元件与材料2018，Vol.37Issue(2)：75-78,4.DOI:10.14106/j.cnki.1001-2028.2018.02.014
基于ANSYS/LS-DYNA板级焊点跌落分析
Drop analysis of board level solder joints based on ANSYS/LS-DYNA
摘要
Abstract
In order to study the influence of stress variation on the board level solder joints under different drop loads, ANSYS LS-DYNA was adopted to analyze the dynamics responses of the PCB assembly. Under different heights and different stiff targeted surface of dropping, the stress concentration area of the solder joints appeared near the interface between the BGA package and pads. The higher the height is, the bigger the stress value is. The bigger the stiffness of the targeted surface and the distribution of the stress are, the easier the solder joint failure is.关键词
LS-DYNA/焊点/跌落/应力/刚性/失效Key words
LS-DYNA/solder joints/drop/stress/stiffness/failure分类
信息技术与安全科学引用本文复制引用
周嘉诚,刘芳..基于ANSYS/LS-DYNA板级焊点跌落分析[J].电子元件与材料,2018,37(2):75-78,4.基金项目
国家自然科学基金项目资助(51775388) （51775388）
湖北省教育厅科学研究计划青年人才项目资助(Q20141608) （Q20141608）
