电子元件与材料2018，Vol.37Issue(3)：64-67,4.DOI:10.14106/j.cnki.1001-2028.2018.03.012
微量Ag、Bi、Ni对无铅微焊点固-液界面扩散的影响
Effect of trace elements Ag, Bi, Ni on solid-liquid interfacial diffusion behavior of lead-free solder joints
摘要
Abstract
In order to study the influence of trace elements on the solid-liquid interfacial diffusion behavior of lead-free solder joints, the Cu/SAC0705+Bi+Ni/Cu solder joints were chose as the main research objects. In costrast with Cu/SAC305/Cu and the Cu/SAC0705/Cu solder joints, the growth and evolution behaviors of interface IMC in three kinds of solder joints were studied after solid-liquid diffusion, and the effects of trace elements Ag, Bi, Ni on the solid-liquid interface diffusion were analyzed. The results show the trace elements Ag, Bi, Ni in the solder can refine the grain size after reflow, which can improve the strength of the interface. The growth rate of interface IMC depends on the grain of interface IMC during a long period of solid-liquid aging. The Cu/SAC0705+Bi+Ni/Cu solder joints have the smallest interface IMC grain size, so its interface IMC has the maximum growth rate of 11.74 μm/h. The Cu/SAC0705/Cu solder joints have the biggest interface IMC grain size, so its interface IMC has the minimum growth rate of 1.24 μm/h.关键词
固-液扩散/界面化合物/微量元素/微焊点/无铅钎料/生长速率Key words
solid-liquid diffusion/intermetallic compound (IMC)/trace elements/micro solder joints/lead-free solder/growth rate分类
信息技术与安全科学引用本文复制引用
李雪梅,张浩,孙凤莲..微量Ag、Bi、Ni对无铅微焊点固-液界面扩散的影响[J].电子元件与材料,2018,37(3):64-67,4.基金项目
国家自然科学基金资助项目(51174069) （51174069）
黑龙江省教育厅基本业务专项青年骨干项目(135209307) （135209307）
