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电子导电胶的最新研究进展

尚承伟

电子元件与材料2018,Vol.37Issue(5):62-66,5.
电子元件与材料2018,Vol.37Issue(5):62-66,5.DOI:10.14106/j.cnki.1001-2028.2018.05.011

电子导电胶的最新研究进展

Research progress of electronic conductive adhesive

尚承伟1

作者信息

  • 1. 安徽四创电子股份有限公司,安徽 合肥 230088
  • 折叠

摘要

Abstract

This paper describes electronic conductive adhesive (ECA) conductive principles consisting of seepage theory, tunneling theory and field emission theory. According to the difference of the conductive direction, ECA is divided into two categories: isotropic conductive adhesive and anisotropic conductive adhesive. Domestic and foreign research progress on the impact of the conductive particle shape and size, the composite of conductive fillers and additives on the conductivity of ECA are systematically introduced. The development direction of electronic conductive adhesive is also pointed out.

关键词

电子导电胶/导电性/综述/导电机理/复合材料/复合型导电填料

Key words

electronic conductive adhesive/conductivity/review/conductive mechanism/composite materials/composite conductive filler

分类

信息技术与安全科学

引用本文复制引用

尚承伟..电子导电胶的最新研究进展[J].电子元件与材料,2018,37(5):62-66,5.

电子元件与材料

OA北大核心CSCDCSTPCD

1001-2028

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