电子与封装2023，Vol.23Issue(12)：9-13,5.DOI:10.16257/j.cnki.1681-1070.2023.0171
BGA封装电路焊球外观异常解决方案研究
Research on Solution for Abnormal Appearances of Solder Balls in BGA Packaging Circuits
丁鹏飞 1王恒彬 1王建超1
作者信息
- 1. 中国电子科技集团公司第五十八研究所,江苏无锡 214035
- 折叠
摘要
Abstract
Abnormal appearances of circuit solder balls may occur during BGA packaging circuit testing using commonly used test sockets.In order to solve the problem of abnormal appearance,a new type of test socket is designed and realized based on the commonly used test sockets.Commonly used test sockets have a spring-loaded needle-type contact structure,while the new test sockets adopt a needle-free design for the contact parts.The effects of two types of sockets on the appearances of solder balls in BGA packaging circuits at different temperatures and operating voltages are verified through experiments,and the results are observed through a microscope.The results show that the optimized design of the socket can significantly reduce the impact on the appearances of solder balls in the BGA packaging circuits during the test process,and at the same time,different temperatures and operating voltages do not have a significant impact on the appearances of solder balls in BGA packaging circuits.关键词
测试插座/焊球外观/无针式设计Key words
test socket/appearances of solder balls/needle-free design分类
信息技术与安全科学引用本文复制引用
丁鹏飞,王恒彬,王建超..BGA封装电路焊球外观异常解决方案研究[J].电子与封装,2023,23(12):9-13,5.
