电子与封装2023，Vol.23Issue(12)：20-23,4.DOI:10.16257/j.cnki.1681-1070.2023.0173
集成电路成品测试的常见问题分析
Analysis of Common Problems in Finished Integrated Circuit Testing
倪宋斌 1马美铭1
作者信息
- 1. 中国电子科技集团公司第五十八研究所,江苏无锡 214035
- 折叠
摘要
Abstract
With the rapid development of the integrated circuit industry,the chip feature size continues to shrink,and the integration and complexity are also increasing,which make the importance of integrated circuit testing continue to rise.As the last step in the production process of the integrated circuit,the finished product testing is also the most comprehensive for electrical performance of the chip.In order to ensure that the chip can still be used in extreme environments,the finished product testing is generally carried out at room temperature(25 ℃),low temperature(-55 ℃)and high temperature(125 ℃),which is aimed at eliminating defective products.In addition to circuit failures caused by poor electrical performance,there are also false failures caused by aging or damage of test hardware,improper test methods and temperature differences.By analyzing the causes of test anomalies,it is found that optimizing the selection of test sockets and the design of test boards as well as optimizing the setting of test programs can reduce test anomalies.These methods are helpful in improving test accuracy.关键词
成品测试/测试设备/开短路测试/功能测试Key words
finished product testing/test equipment/open-short circuit testing/functional testing分类
信息技术与安全科学引用本文复制引用
倪宋斌,马美铭..集成电路成品测试的常见问题分析[J].电子与封装,2023,23(12):20-23,4.
