面向高密度印刷电路板圆形特征的快速铺铜算法OACSTPCD

With the increasing integration of printed circuit board,traditional methods are unable to meet the requirements for size and weight.Copper plating,a crucial step in PCB design,plays a significant role in improving the performance and effectiveness of PCB.To address the numerous circular features on large-scale PCB,a fast shape filling algorithm is proposed.This algorithm utilizes graphic in-formation classification and identifies islands that may arise during the copper plating process.The core idea of the algorithm is as fol-lows:firstly,a large number of features are divided into regions based on their graphical information.Then,clustering is performed based on collision relationships.The outer contour chains and isolated island chains are obtained based on the clustering results.Finally,the re-sult is obtained through the relationship between the contour chains of loops and holes.The algorithm is implemented in a Windows 10 environment with a 3.20 GHz processor and 16 GB memory,and industrial test data is used to validate its performance.The experimen-tal results demonstrate that compared to an open-source copper plating tool based on fitting polygons,the proposed algorithm is inde-pendent of the number of polygon edges and achieves a time improvement of approximately 60％.