单片机与嵌入式系统应用2024，Vol.24Issue(1)：39-45,7.
面向高密度印刷电路板圆形特征的快速铺铜算法
Fast shape filling algorithm for circular features in high-density PCB
摘要
Abstract
With the increasing integration of printed circuit board,traditional methods are unable to meet the requirements for size and weight.Copper plating,a crucial step in PCB design,plays a significant role in improving the performance and effectiveness of PCB.To address the numerous circular features on large-scale PCB,a fast shape filling algorithm is proposed.This algorithm utilizes graphic in-formation classification and identifies islands that may arise during the copper plating process.The core idea of the algorithm is as fol-lows:firstly,a large number of features are divided into regions based on their graphical information.Then,clustering is performed based on collision relationships.The outer contour chains and isolated island chains are obtained based on the clustering results.Finally,the re-sult is obtained through the relationship between the contour chains of loops and holes.The algorithm is implemented in a Windows 10 environment with a 3.20 GHz processor and 16 GB memory,and industrial test data is used to validate its performance.The experimen-tal results demonstrate that compared to an open-source copper plating tool based on fitting polygons,the proposed algorithm is inde-pendent of the number of polygon edges and achieves a time improvement of approximately 60％.关键词
印刷电路板/快速铺铜/孤岛搜索/圆形特征/轮廓求解Key words
printed circuit board/fast shape filling/island search/circular features/envelope chain分类
信息技术与安全科学引用本文复制引用
方敬苛,徐宁,张雪琳,孙贤伟,胡建国..面向高密度印刷电路板圆形特征的快速铺铜算法[J].单片机与嵌入式系统应用,2024,24(1):39-45,7.基金项目
科技创新2030-"新一代人工智能"重大项目(2021ZD0114600) （2021ZD0114600）
深圳基金重点项目"基20220019软件自动化设计和生成算法研究"(JCYJ20220818102002005). （JCYJ20220818102002005）
