电子与封装2024，Vol.24Issue(1)：1-5,5.DOI:10.16257/j.cnki.1681-1070.2024.0001
封装用玻璃基板的热应力翘曲研究
Research on Thermal Stress Warping of Glass Substrates for Packaging
闫伟伟 1朱泽力 1李景明1
作者信息
- 1. 深圳莱宝高科技股份有限公司,广东深圳 518000
- 折叠
摘要
Abstract
Thermal stress warping of glass substrates for packaging is investigated through a combination of theoretical analysis,simulation and experimental verification.The results show that the glass substrates have a significant effect in reducing thermal stress warping compared to the traditional organic compound substrates.Taking the bi-material plate model as the research object,the effects of different factors on thermal stress warping are summarized by analyzing and comparing different models.Increasing the thickness of the glass substrates has the most significant effect on reducing warping.Improving the coefficient of thermal expansion(CTE)of the glass substrates to be close to the CTE of the stacked films can help to reduce warping.Dividing the stacked film into more zones can significantly improve warping.Meanwhile,gravity is also an important factor that cannot be ignored.The placement of the product determines the direction of warping and affects the magnitude of the warping value.关键词
热应力翘曲/玻璃基板/仿真实验/双材料板Key words
thermal stress warping/glass substrates/simulation experiment/bi-material plate分类
信息技术与安全科学引用本文复制引用
闫伟伟,朱泽力,李景明..封装用玻璃基板的热应力翘曲研究[J].电子与封装,2024,24(1):1-5,5.
