电子与封装2024，Vol.24Issue(1)：11-16,6.DOI:10.16257/j.cnki.1681-1070.2024.0008
接触式、双界面式智能卡机械强度测试失效及改善措施
Mechanical Strength Test Failure and Improvement Measures of Contact and Dual-Interface Smart Cards
吴彩峰 1王修垒 1仝飞1
作者信息
- 1. 北京中电华大电子设计有限责任公司射频识别芯片检测技术北京市重点实验室,北京 102209
- 折叠
摘要
Abstract
Mechanical strength is an important indicator for evaluating the reliability of contact and dual-interface smart cards.Product failures occur from time to time during mechanical strength testing.Therefore,it is very important to conduct an in-depth study of failure phenomena those occur during mechanical strength testing of contact and dual-interface smart cards.Starting from the structure and materials of smart cards and the whole manufacturing process,including chip manufacturing,module packaging and smart card assembly,the factors affecting the mechanical strength of smart cards are studied.By analyzing and summarizing the physical characteristics of bare chips,carrier types,surface roughness of bare chips,sealing process of the modules and the milling groove parameters,measures and optimization directions for improving the mechanical strength of smart cards are proposed.关键词
智能卡/机械强度/三轮测试/失效现象Key words
smart cards/mechanical strength/three-wheel testing/failure phenomenon分类
信息技术与安全科学引用本文复制引用
吴彩峰,王修垒,仝飞..接触式、双界面式智能卡机械强度测试失效及改善措施[J].电子与封装,2024,24(1):11-16,6.
