电子与封装2024，Vol.24Issue(1)：17-29,13.DOI:10.16257/j.cnki.1681-1070.2024.0011
人工智能芯片先进封装技术
Advanced Packaging Technology for Artificial Intelligence Chips
田文超 1谢昊伦 2陈源明 3赵静榕 3张国光4
作者信息
- 1. 西安电子科技大学机电工程学院,西安 710071
- 2. 西安电子科技大学杭州研究院,杭州 311231
- 3. 上海轩田工业设备有限公司,上海 201109
- 4. 佛山市蓝箭电子股份有限公司,广东佛山 528051
- 折叠
摘要
Abstract
With the rapid development of artificial intelligence(AI)and integrated circuits,artificial intelligence chips have become the focus of global science and technology competition.In the post-Moore era,the computing power enhancement and power dissipation reduction of AI chips increasingly rely on advanced packaging technologies with characteristics such as TSV,micro-bump,heterogeneous integration and Chiplet.Starting from the classification and characteristics of AI chips,the typical advanced packaging technologies at home and abroad are classified and summarized.On this basis,the challenges faced by advanced packaging structure reliability and packaging heat dissipation are summarized and corresponding solutions are proposed.The future development of advanced packaging technology is prospected for AI applications.关键词
人工智能芯片/先进封装/可靠性/封装散热Key words
artificial intelligence chips/advanced packaging/reliability/packaging heat dissipation分类
信息技术与安全科学引用本文复制引用
田文超,谢昊伦,陈源明,赵静榕,张国光..人工智能芯片先进封装技术[J].电子与封装,2024,24(1):17-29,13.
