摘要
Abstract
Multilayer multi-component composite microspheres,with high hardness,good electrical and thermal conductivity,high reliability and other excellent performance,are critical electronic materials that determines the interconnection reliability of three-dimensional high-density microelectronic products under long-term service conditions.Its preparation technology mainly includes alloy segregation(Gas Atomization Technology,Uniform Droplet Spray,and Drop Tube Technology)and chemical plating.Composite microspheres are usually multilayer multi-component core-shell structure.The main constituents of the core are high hardness and high melting point metals such as Cu and Al to improve the stability of the microspheres.The shell is multi-layered with possible constituents such as Sn,Sn-Ag,Sn-In,Sn-Bi,Sn-Ag-Cu and other tin-based alloys,which are used for bonding.Here the recent research progress are reviewed on the preparation technology and performance of composite microspheres with core-shell structure for bonding in the field of microelectronic packaging.The problems are analyzed for using the composite microspheres,and the development of the composite microsphere preparation technology are prospected.关键词
微电子键合/复合微球/综述/焊锡球/微电子封装Key words
microelectronic bonding/composite microspheres/review/solder balls/microelectronic packaging分类
信息技术与安全科学
