摘要
Abstract
In view of the reliability problem of the power module solder layer under vibration load,three sets of power module models were established with the chip solder layers as SAC305,Sn63Pb37,and Ag3.5Sn96.5 materials,respectively.The models were verified using the vibration analyzers,acceleration sensors,etc.The modal analysis,harmonic response analysis and random vibration analysis of different models were also carried out using finite element simulation software.The Steinberg model based on Gaussian distribution and Manson's empirical high-fatigue relationship equation,combining with the linear fatigue damage accumulation criterion,were chosen to predict the vibration fatigue life of the power modules with different material chip solder layers.The results show that the power modules of different materials are susceptible to the resonance phenomena at the first order intrinsic frequency and the fifth order intrinsic frequency.The material of the solder layer has no effect on the intrinsic frequency,and the direction of the applied excitation has an important influence on the magnitude of the stresses on the solder layer.The vibration fatigue life of the solder layer under SAC305,Sn63Pb37,and Ag3.5Sn96.5 are 8.97×105 h,6.39×105 h,and 1.98×104 h,respectively.关键词
功率模块/焊料层/谐响应分析/随机振动/振动疲劳寿命Key words
power module/solder layer/harmonie response analysis/random vibration/vibration fatigue life分类
信息技术与安全科学
