表面技术2024，Vol.53Issue(3)：101-112,12.DOI:10.16490/j.cnki.issn.1001-3660.2024.03.010
用于柔性电子器件的有机/无机薄膜封装技术研究进展
Research Progress of Organic/Inorganic Thin Film Packaging Technology for Flexible Electronic Devices
摘要
Abstract
Organic/inorganic film packaging technology is widely used in the fields of OLED,quantum dot display and organic photovoltaic.It is a new type of flexible packaging technology.The work aims to summarize the development trend of organic/inorganic film packaging technology in recent years.First of all,the development of traditional hard cover packaging methods and thin film packaging methods and its advantages and disadvantages were outlined.Secondly,the preparation methods of organic/inorganic thin films were systematically summarized,such as atomic layer deposition,plasma chemical vapor deposition,etc.Then,the principles and applications of different preparation methods were elaborated in detail.Once again,the effects of micro defects,internal stress,and material interface engineering on the packaging performance of organic/inorganic thin films were discussed.By analyzing and summarizing the technical points of preparing organic/inorganic packaging thin films,such as substrate surface pretreatment,introduction of neutral layers,and adjustment of interlayer stress,the high-quality packaging thin films were obtained.Finally,the intrinsic barrier mechanism of organic/inorganic packaging films was explored,and it was proposed that gas transport in organic/inorganic films was mainly through Nussen diffusion.Strategies to improve film packaging were summarized,including extending the gas diffusion path,actively introducing barrier groups,and modifying the film surface.This review presents the key challenges faced by future thin film packaging technology,which can provide certain reference value for the development of flexible electronic device packaging technology.关键词
柔性电子/有机/无机薄膜封装/界面/内应力/阻隔机制Key words
flexible electronics/organic/inorganic thin film packaging/interface/internal stress/barrier mechanism分类
通用工业技术引用本文复制引用
冯尔鹏,马凤英,董茂进,韩仙虎,蔡宇宏,冯煜东,王毅,马敏,王冠,秦丽丽..用于柔性电子器件的有机/无机薄膜封装技术研究进展[J].表面技术,2024,53(3):101-112,12.基金项目
中国航天科技集团自主研发项目(JSKF202112140007)Independent Research and Development Project of China Aerospace Science and Technology Corporation(JSKF202112140007) （JSKF202112140007）
