电子与封装2024，Vol.24Issue(2)：1-10,10.DOI:10.16257/j.cnki.1681-1070.2024.0026
Chiplet封装用有机基板的信号完整性设计
Signal Integrity Design of Organic Substrates for Chiplet Package
汤文学 1孙莹 2周立彦2
作者信息
- 1. 中科芯集成电路有限公司,江苏无锡 214072
- 2. 无锡中微高科电子有限公司,江苏无锡 214035
- 折叠
摘要
Abstract
Chiplet technology brings a balance of chip size,performance and cost,and has received much attention from the industry and users.For different Chiplet package schemes,the parameters and performance of electrical interconnections in advanced/standard package schemes are compared and interpreted.Based on the domestic organic substrate process,a technical feasibility study of Chiplet standard package scheme is conducted from the perspectives of design and simulation.With reasonable termination configurations,the performance of signal channels can meet the design requirements of UCIe.The results show that the characteristics of low-loss and flexible wiring of organic substrates make up to some extent for the shortcomings of silicon substrates in terms of interconnect density and energy efficiency.This study provides a reference for the translation of the Chiplet universal protocol for domestic applications and the design of Chiplet package.关键词
芯粒/有机基板/信号完整性/国产化应用Key words
Chiplet/organic substrate/signal integrity/domestic application分类
信息技术与安全科学引用本文复制引用
汤文学,孙莹,周立彦..Chiplet封装用有机基板的信号完整性设计[J].电子与封装,2024,24(2):1-10,10.
