电子与封装2024，Vol.24Issue(2)：11-21,11.DOI:10.16257/j.cnki.1681-1070.2024.0027
有机封装基板的芯片埋置技术研究进展
Progress on Chip Embedded Technology for Organic Package Substrates
杨昆 1朱家昌 1吉勇 1李轶楠 1李杨1
作者信息
- 1. 无锡中微高科电子有限公司,江苏无锡 214035
- 折叠
摘要
Abstract
Organic package substrates provide support,protection and electrical interconnection for ICs and are one of the most critical materials for IC packaging.System level,miniaturization and low cost are the trends of IC packaging.Embedding active and passive components into the package substrates allows for the efficient utilization of internal space of the substrates and the release of more surface space,which is an important approach to reduce the size of the package system.Therefore,the chip embedded technology for organic package substrates develops rapidly.The development process of chip embedded technology for organic package substrates is mainly introduced,the types of chip embedded process routes for organic package substrates are summarized,and different chip embedded technology solutions and their application fields in the last decade are highlighted.On this basis,the research prospects of the chip embedded technology for organic package substrates are prospected.关键词
有机封装基板/芯片埋置技术/系统级封装/异质集成Key words
organic package substrate/chip embedded technology/system in package/heterogeneous integration分类
信息技术与安全科学引用本文复制引用
杨昆,朱家昌,吉勇,李轶楠,李杨..有机封装基板的芯片埋置技术研究进展[J].电子与封装,2024,24(2):11-21,11.
