电子与封装2024，Vol.24Issue(2)：22-27,6.DOI:10.16257/j.cnki.1681-1070.2024.0031
基于高密度有机基板工艺的Ka波段天线设计与制造
Design and Manufacture of Ka-Band Antenna Based on High Density Organic Substrate Process
庞影影 1周立彦 1王剑峰 1王波1
作者信息
- 1. 无锡中微高科电子有限公司,江苏无锡 214035
- 折叠
摘要
Abstract
Compared with the traditional integration technology,the multi-layer structure of the organic substrate can not only integrate multiple antennas,such as phased array antennas and stacked microstrip antennas,but also shows great advantages in wiring density,chip embedding and package integration.The design and fabrication process of Ka-band stacked microstrip antenna based on high density organic substrate process are introduced,and its reflection characteristics are verified by testing.The use of organic substrate to integrate antennas is conducive to the miniaturization of wireless communication systems,and it has great potential for application in the fields of communication and radar detection.关键词
毫米波微带天线/高密度基板/无引线集成Key words
millimeter wave microstrip antenna/high density substrate/wire-free integration分类
信息技术与安全科学引用本文复制引用
庞影影,周立彦,王剑峰,王波..基于高密度有机基板工艺的Ka波段天线设计与制造[J].电子与封装,2024,24(2):22-27,6.
