电子与封装2024，Vol.24Issue(2)：28-35,8.DOI:10.16257/j.cnki.1681-1070.2024.0032
有机基板用增层膜性能与一致性的探讨
Study on Properties and Consistency of Build-up Film for Organic Package Substrate
李会录 1张国杰 2魏韦华 3李轶楠 2刘卫清 3杜博垚3
作者信息
- 1. 西安天和嘉膜工业材料有限责任公司,西安 710119||西安科技大学材料科学与工程学院,西安 710054
- 2. 无锡中微高科电子有限公司,江苏无锡 214061
- 3. 西安天和嘉膜工业材料有限责任公司,西安 710119
- 折叠
摘要
Abstract
Build-up film is a key material for organic substrate used in integrated circuit package,which plays the role of insulation,thermal conductivity and electronic connection.The performance of the build-up film is determined by the resin system,curing system,filler,semi-curing treatment of the film and other factors.From the current research status of build-up film at home and abroad,as well as the development trend of organic substrate used in integrated circuit package,the factors affecting the consistency of the film performance are studied,and the development direction of low shrinkage,high peel strength,low dielectricity,and thermal stability of build-up film is discussed.Controlling the properties such as epoxy equivalent,molecular weight,and molecular weight distribution of electronic grade epoxy resin can achieve film processability and performance consistency.Epoxy based build-up films are the mainstream products of high-density package organic substrates.With the requirement of low dielectric constant and loss,the modification of nonpolar and symmetric functional groups of epoxy resin has become increasingly urgent.关键词
有机基板/增层膜/成膜性/填料/半固化Key words
organic substrate/build-up film/film-forming/filler/semi-curing分类
化学化工引用本文复制引用
李会录,张国杰,魏韦华,李轶楠,刘卫清,杜博垚..有机基板用增层膜性能与一致性的探讨[J].电子与封装,2024,24(2):28-35,8.
