电子与封装2024，Vol.24Issue(2)：36-42,7.DOI:10.16257/j.cnki.1681-1070.2024.0037
有机封装基板界面处理工艺对结合强度与可靠性的影响
Effect of Interface Processing Technology on Bonding Strength and Reliability of Organic Package Substrate
摘要
Abstract
Package substrate delamination is a common failure mode in the plastic packaged circuit,and plastic package substrate delamination will lead to open circuit problem throughout the circuit.Substrate delamination is usually related to weak bonding strength between interfaces and moisture in the substrate.Effects of roughening of the copper surface and plasma cleaning of the Ajinomoto buildup film(ABF)surface on the morphology,roughness and interfacial bonding of the copper and the ABF surface are studied.Analysis results of the stripping interfaces between the roughened copper surfaces and ABF resins show that the fracture failure between interfaces is a physical bonding failure.At the same time,the water absorption during substrate processing and the influence of different baking parameters on the water removal effect are also investigated.Through the introduction of copper surface roughening treatment,plasma cleaning and baking before lamination,the problem of delamination after substrate package is solved,while the packaged products pass some thermal reliability tests.关键词
封装基板/味之素堆积膜/粗化处理/等离子清洁/封装可靠性Key words
package substrate/Ajinomoto buildup film/roughening treatment/plasma cleaning/package reliability分类
信息技术与安全科学引用本文复制引用
梁梦楠,陈志强,张国杰,姚昕,李轶楠,张爱兵..有机封装基板界面处理工艺对结合强度与可靠性的影响[J].电子与封装,2024,24(2):36-42,7.基金项目
科技部重点研发计划(2020YFB1807303) （2020YFB1807303）
