电子与封装2024，Vol.24Issue(2)：43-50,8.DOI:10.16257/j.cnki.1681-1070.2024.0039
大尺寸有机基板的材料设计与封装翘曲控制
Material Design and Package Warpage Control for Large-Size Organic Substrates
李志光 1胡曾铭 2张江陵 1范国威 2唐军旗 1刘潜发 1王珂2
作者信息
- 1. 广东生益科技股份有限公司,广东东莞 523808
- 2. 南方科技大学系统设计与智能制造学院,广东深圳 518055
- 折叠
摘要
Abstract
Due to the characteristics such as large size and large number of layers,flip chip ball grid array(FCBGA)substrates can meet the needs of large-size chips for ultra-high-speed computing.As the chip size increases,the warpage problem of organic substrates becomes more prominent.Therefore,technological upgrading of organic substrate materials in terms of coefficient of thermal expansion(CTE),modulus,resin shrinkage rate,and stress control is required.The large-size organic substrate materials used in FCBGA substrates are studied focusing on the key performance parameters,such as CTE,modulus,and resin shrinkage rate,the selection of materials such as resin matrix,inorganic filler,and glass fiber cloth,as well as stress control in the production and manufacturing process are further explored,and the development trend of large-size organic substrate material technology is outlooked.关键词
大尺寸有机基板材料/翘曲/应力控制Key words
large-size organic substrate material/warpage/stress control分类
信息技术与安全科学引用本文复制引用
李志光,胡曾铭,张江陵,范国威,唐军旗,刘潜发,王珂..大尺寸有机基板的材料设计与封装翘曲控制[J].电子与封装,2024,24(2):43-50,8.
