电子与封装2024，Vol.24Issue(2)：51-56,6.DOI:10.16257/j.cnki.1681-1070.2024.0040
有机封装基板标准化工作现状及发展思考
Current Status and Development Thoughts of Standardization Work on Organic Package Substrate
李锟 1曹易 2田欣 1薛超1
作者信息
- 1. 中国电子技术标准化研究院,北京 100007
- 2. 全国印制电路标准化技术委员会(SAC/TC47),北京 100007
- 折叠
摘要
Abstract
With the development of China's integrated circuit industry,organic package substrate,as a special type of printed circuit board(PCB)that serves as an important package component,has shown a rapid growth trend,and the corresponding standardization needs are increasingly apparent.Past strategies of PCB field standardization in China are reviewed,and the necessity of work strategy adjusting is analyzed.Based on the organization and summary of key points in the organic package substrate industry development,new development strategies of standardization work on organic package substrate are proposed.Key tasks of standardization based on customer contact,product yield control,and raw material research and development are pointed out.In view of the development trend,focusing on embedded substrate,which may bring restructuring to the whole organic package substrate industry chain in the future,strategies and tasks of the future standardization work in this industrial change in China are put forward.关键词
封装基板/标准化/嵌入式基板/印制电路板Key words
package substrate/standardization/embedded substrate/printed circuit board分类
信息技术与安全科学引用本文复制引用
李锟,曹易,田欣,薛超..有机封装基板标准化工作现状及发展思考[J].电子与封装,2024,24(2):51-56,6.
