电子与封装2024，Vol.24Issue(2)：57-63,7.DOI:10.16257/j.cnki.1681-1070.2024.0050
基于FCBGA封装应用的有机基板翘曲研究
Study on Organic Substrate Warpage Based on FCBGA Packaging Application
李欣欣 1李守委 1陈鹏 1周才圣1
作者信息
- 1. 无锡中微高科电子有限公司,江苏无锡 214035
- 折叠
摘要
Abstract
Organic substrates are important carriers for IC packaging,the characteristics of their fabrication materials have an important impact on the stability and reliability of the packaging process.In response to the warpage problem of flip chip ball grid array(FCBGA)organic substrates during the reflow soldering process,a thermal deformation tester is used to study the coplanarity and deformation of organic substrates with different sizes and different core plate thicknesses during the reflow soldering process,and the warpage behavior of FCBGA organic substrates is studied.In response to the warpage problem of large-size FCBGA organic substrates during the reflow soldering process,improvement measures are proposed in terms of dehumidification,clamping carrier and optimization of reflow soldering curves,which provide a reference for the packaging application of FCBGA organic substrates.关键词
FCBGA有机基板/再流焊/翘曲/脱湿Key words
FCBGA organic substrate/reflow soldering/warpage/dehumidification分类
信息技术与安全科学引用本文复制引用
李欣欣,李守委,陈鹏,周才圣..基于FCBGA封装应用的有机基板翘曲研究[J].电子与封装,2024,24(2):57-63,7.
