电子与封装2024，Vol.24Issue(2)：64-73,10.DOI:10.16257/j.cnki.1681-1070.2024.0064
有机封装基板常见失效模式与制程控制
Common Failure Modes and Process Control of Organic Package Substrates
周帅林 1孟凡义 1张领 1李国有 1滕少磊1
作者信息
- 1. 清河电子科技(山东)有限责任公司,济南 250000
- 折叠
摘要
Abstract
With the rapid development of packaging technology,integrated circuit packaging needs to have characteristics such as miniaturization,multi-functionality,high frequency,high speed,high performance and low cost.In order to meet the needs of advanced packaging,organic package substrates are developing towards smaller aperture,high wiring density and smaller size.This development trend puts forward higher requirements on mechanical stability,heat dissipation and electrical performance of substrates,bringing great challenges to the control of the reliability of internal interconnections,ion migration and firmness of solder joints.Failure modes such as hole bottom cracking,ion migration and solder joint cracking are studied,their failure mechanisms are analyzed,influencing factors of failure modes are summarized,and effective control measures for substrate manufacturing process are proposed in a targeted manner.关键词
孔底开裂/离子迁移/焊点开裂/失效模式/制程控制Key words
hole bottom cracking/ion migration/solder joint cracking/failure mode/control for manufacturing process分类
信息技术与安全科学引用本文复制引用
周帅林,孟凡义,张领,李国有,滕少磊..有机封装基板常见失效模式与制程控制[J].电子与封装,2024,24(2):64-73,10.
