电子与封装2024，Vol.24Issue(5)：1-8,8.DOI:10.16257/j.cnki.1681-1070.2024.0056
射频组件用键合金带的研究进展
Research Progress of Bonding Au Ribbon for Radio Frequency Components
摘要
Abstract
The rapid development of radio frequency components has promoted the widespread application of 5G communication technology.As a key bonding material for radio frequency component packaging,Au ribbon integrates the board-level system into a complete component circuit system and plays a crucial role in component size and performance.At present,the research and development of bonding Au ribbon have become a research hotspot in academia and industry.The research progress of bonding Au ribbon for radio frequency components used in industrial applications in recent years is discussed and analyzed,the strengthening mechanism on Au ribbon and the impact on bonding performance of trace elements are summarized.The microwave characteristics of bonding Au ribbon and bonding Au wire are highlighted.Under the same conditions,bonding Au ribbon has better signal transmission capability than bonding Au wire,especially in the high-frequency band(above 20 GHz)the signal transmission capability of bonding Au ribbon is more significant.The problems encountered in the preparation process and engineering applications of bonding Au ribbon are reviewed,and the future development trend of bonding Au ribbon is summarized.关键词
射频组件/键合/金带/封装技术Key words
radio frequency component/bonding/Au ribbon/packaging technology分类
信息技术与安全科学引用本文复制引用
谢勇,肖雨辰,唐会毅,王云春,侯兴哲,吴华,吴保安,谭生,孙玲..射频组件用键合金带的研究进展[J].电子与封装,2024,24(5):1-8,8.基金项目
国家电网科技项目"基于四分之一平方法与热电变换的宽频电能精密测量技术研究"(5700-202227445A-2-0-ZN) （5700-202227445A-2-0-ZN）
