电子与封装2024，Vol.24Issue(5)：9-13,5.DOI:10.16257/j.cnki.1681-1070.2024.0052
混合集成电路的自动上芯吸嘴开发
Development of Automatic Chip Loading Nozzles with Hybrid Integrated Circuits
梁笑笑 1吴海峰1
作者信息
- 1. 天水七四九电子有限公司,甘肃天水 741000
- 折叠
摘要
Abstract
Chip mounting is a key link in the packaging process of microelectronic component,and the reliability of the chip after mounting has an important impact on the overall performance and quality of the circuit.An automatic chip loading nozzle for thick-film hybrid integrated circuits is introduced,which is based on the IP-500 automatic chip loading machine and is developed for the characteristics of thick-film hybrid integrated circuits and domestic bare chips.Starting from the structure and material of the automatic chip loading nozzle,the finite element simulation software is used to calculate the pressure and focus on the stress distribution of the nozzle and the chip.The results show that the optimized rubber nozzle can effectively solve the problem of damage occurring in the automatic chip loading process of domestic bare chips.关键词
封装技术/厚膜混合集成电路/国产裸芯片/吸嘴/有限元仿真Key words
packaging technology/thick-film hybrid integrated circuit/domestic bare chip/nozzle/finite element simulation分类
信息技术与安全科学引用本文复制引用
梁笑笑,吴海峰..混合集成电路的自动上芯吸嘴开发[J].电子与封装,2024,24(5):9-13,5.
